Interleaf / Bump / Spacer Tape

Advantek’s wide range of forming processes provides a variety of unique solutions for specialty applications. The Protective Interleaf Tape™ is designed to separate sensitive components such as flex circuits or components manufactured in a continuous strip. Packaged components have minimal contact with the tape, making it ideal for storage and shipment of small, thin and lightweight component devices. These forming technologies are available to support custom projects.

• Designed to protect sensitive thin-layer components during shipping and storage
• “Bump” feature on the edges of tape allow for only minimal contact with packaged components
• Cleanroom process option available
• Static-dissipative to protect ESD-sensitive components from electrostatic discharge