Highlighting Carrier Tape Solutions at SEMICON Taiwan 2024

Advantek kicked off September by participating in #SemiConTaiwan2024, one of the semiconductor industry’s most anticipated events.

With over 80,000 attendees, this year’s ‘Breaking Limits: Powering the AI Era’ theme spotlighted advancements in fan-out panel-level packaging (FOPLP) and how Advantek’s UPI products, integrating on-tape bar codes, provide reliable off-component traceability.

Our Taiwan team had the chance to connect with customers, demonstrating how Advantek’s tape and reel solutions are ready to scale.