Bare Die

The packaging requirements for bare die are pushing the development of new innovative technologies. Optimal handling of die requires the design and manufacturing of carrier tapes with very high precision, as well as solutions for the protection of fragile die or die with sensitive do not touch areas. The adoption of new die based packaging technologies such as stacked die (2.5D & 3D) and wafer level packaging (FIWLP and FOWLP) are also driving the growth for new robust high precision tape designs for die and other micro-sized components.