Applications | Tape and Reel | Component Packaging

SOIC, QFN/ML, BGA, SOT, QFP, DPAK, SiP, PoP

SOT Packages, Capacitors, Inductors, Diodes, ESD Protection, Fuses

Micro Die, Wafer Level Packaging, Chip Scale Packaging, FIWLP, FOWLP, Stacked Die (2.5D & 3D)

Low Power LEDs, Mid/High Power Packages, Domed Packages, LED Modules, Lenses, LED Die

Connectors, Clips, Springs, Switches, Shields, Sockets, SiP, Modules

Bump, Interleaf, Spacer Tape,...